Rigid Polyimide Film

Modohar PIA(amber)/PAB(supper foggy black) polyimide film are rigid, high performance substrate film and they are kind of heat resistant films possessing excellent physical, chemical, and electrical properties. As the polymer structure having a high rigidity and strong intermolecular forces, thus has superior chemical, physical, electrical and radiation-resistant properties, especially those having a lower coefficient of thermal expansion, and high rigidity and excellent dimensional stability. They can be applied to various harsh working environment.

Application

  • 1. Electric magnetic wire and cable coiling, motor slot liners, transformer interlayer insulation.
  • 2. The backing material of pressure-sensitive adhesive tape, F46 (FEP) tape.
  • 3. The substrates of Flexible Printed Circuits Board (F-PCB).
  • 4. Opaque cover-layers, Satellite blankets, Radiant heat absorber.

Grade Table

Designation Nominal Thickness Width (mm)
PIA025 1 mil / 25μm 520 / 250 /other
PIA050 2 mil / 50μm 520 / 250 /other
PIA075 3 mil / 75μm 520 / 250 /other
PAB025 1 mil / 25μm 520 / 250 /other
PAB050 2 mil / 50μm 520 / 250 /other
PAB075 3 mil / 75μm 520 / 250 /other